Communications Project Examples
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- Subtractive Cu (FPC) or additive silver (PTF) solutions
- Broad range of dielectric materials: PET, PI, PEN, PEI with flame retardant adhesive system for UL flammability rating
- SMD (LED and passive components) attachment using POLYSOLDER® low temperature lead-free conductive adhesive and UV cured junction encapsulant for strain relief
- Various membrane switch technologies including metal domes, polydomes, SMT switches or non tactile solutions.
- Double sided silver with printed carbon PTF through hole via interconnects
- Printed ZIF tail connector
- Value added assembly to molded plastic chassis
Handle interconnection flex
- Double Sided thin PI laminate
- High ductility Rolled Annealed (RA) copper
- High resolution photoimageable soldermask or ultra thin coverlayer film
- High reliability corrosion resistant electrolytic Ni/Au plating finish for insertion contact
Camera flex
- Exclusive PALFLEX® Adhesiveless R2R Film
- Patented controlled impedance, silver epoxy shield layer.
- 0.3mm ZIF terminations
- High resolution photoimageable soldermask or ultra thin coverlayer film
- Leading edge electrolytic and immersion plating finshing: Ni/Au, SnPb, Sn, OSP, compatible with all methods of connection.
DESKPHONE
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- PTF technology on thin polyester film
- Internal material conditioning resulting in superior dimensional stability
- Proprietary silver and carbon ink formulation
- Double sided silver with printed carbon PTF through-hole via interconnects
- SMD (LED and passive components) attachment using POLYSOLDER® low temperature lead-free conductive adhesive and UV cured junction encapsulant for strain relief
See additional project examples for Parlex OEM clients:
- Printer project examples
- Display project examples
- Communications project examples
- Portable electronics examples