Portable Electronics Project Examples

Display driver flex

Broad range of dielectric materials: PET, PI, PEN, PEI with flame retardant adhesive system for UL flammability rating
Exclusive PALFLEX® Adhesiveless Roll-to-Roll (R2R) Film
Proprietary anisotropic adhesive interconnection technology
Leading edge electrolytic and immersion plating finshing: Ni/Au, SnPb, Sn, OSP, compatible with all methods of connection.
All types of circuit end finishing to accommodate miniature connectors such as LIF (low insertion force) and ZIF (zero insertion force)
Multi layer capability
UL rated
RoHS compliant

Broad range of dielectric materials: PET, PI, PEN, PEI, thin glass epoxy with flame retardant adhesive system for UL flammability rating
R2R Single sided and double sided processing
Ni/Au R2R processing for high reliable connection
Low temperature proprietary assembly processes suitable for polyester material with Polysolder® Adhesive

Subtractive Cu (FPC) or additive silver (PTF) solutions
Broad range of dielectric materials: PET, PI, PEN, PEI with flame retardant adhesive system for UL flammability rating
SMD (LED and passive components) attachment using POLYSOLDER® low temperature lead-free conductive adhesive and UV cured junction encapsulant for strain relief
Various membrane switch technologies including metal domes, polydomes, SMT switches or non tactile solutions.
Double sided silver with printed carbon PTF through hole via interconnects

Exclusive PALFLEX® Adhesiveless Roll-to-Roll (R2R) Film
Patented controlled impedance, silver epoxy shield layer.
0.3mm ZIF terminations
High resolution photoimageable soldermask or ultra thin coverlayer film
Leading edge electrolytic and immersion plating finshing: Ni/Au, SnPb, Sn, OSP, compatible with all methods of connection.

Let Parlex design and assemble your next flexible circuitry challenge! Contact your local Parlex Representative for more information!