Electronic Identification

Parlex offers design services, prototyping, manufacturing and value-added assembly for contactless and Smart Card applications in a wide range of markets including banking, telecommunication, transport, electronic passport, asset tracking & brand protection by using Parlex SMART TAPE® Roll-to-Roll FPC or standard processes.

Parlex SMART TAPE® Selectively Additive Technology employs high speed printing technology and proprietary material and processing techniques to produce circuitry in an environmentally friendly manner. Traces as small as 300 microns (0.012 inches) wide are printed and plated directly onto the flexible substrate material. With no pattern etching required, the process waste streams associated with conventional photolithography are eliminated. Currently available with ED copper thickness between 8 and 35 microns (1/4 to 1 ounce copper) on 75 micron (0.003 inch) thick polyester film, Parlex SMART TAPE® technology is ideal for automotive, telecommunications, and RFID circuit applications.

SMART TAPE® Semi-Additive Copper FPC employs proprietary and custom built equipment to make superior, cost effective circuits for SMART CARDS, RFID, cell phone and a host of other high volume applications. Traces as small as 70µm wide (0.0028”) enable double sided high density circuitry with 50µm printed through holes, especially suitable in today's miniaturizing world. SMART TAPE® Semi-Additive FPC is currently produced with copper thickness ranging from 1 to 30µm on 50 and 75µm PET, PEI or PI film.

Radio Frequency Identification (RFID) Tags / Inlets from Parlex are flexible circuits that function as a low cost solution by combining a printed or etched antenna onto a low cost substrate with a flip chip placed at very high volume.

  • Low cost Polymer Thick Film (PTF) or Copper antenna on a PET substrate- metallization based upon frequency required; other substrates are available (paper, ABS, PVC, etc.)
  • Flip chip attachment assembly
  • Reliable attachment attained using Parlex developed anisotropic conductive (Z-Axis) adhesive
  • Wafer handling service management available, including bumping, thinning, and dicing
  • Available for 13.56MHz, 900 MHz, and 2.45GHz applications; (other frequencies available upon request)

Contract Development, Manufacturing and Assembly Services:

Parlex's expertise in design, prototyping and scale-up, from product concept stage to high volume manufacturing, focuses on introducing product rapidly and effectively to market, designing in quality, cost savings, flexibility and scalability. >> More information

Customer and Technical Service and Support:

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Learn more about SMART TAPE® Roll-to-Roll Additive Copper FPC

- Learn more about Parlex Design and Value Added Services
- See a summary of Parlex Quality Certifications and Manufacturing facilities

Featured Product:

Flexible printed circuit with smt mounted switches and leds

Let Parlex design and assemble your next flexible circuitry challenge! Contact your local Parlex Representative for more information!