Electronic Identification Project Examples
Smartcard
- Broad range of dielectric materials: PET, PI, PEN, PEI, thin glass epoxy with flame retardant adhesive system for UL flammability rating
- Exclusive PALFLEX® Adhesiveless Roll-to-Roll (R2R) Film
- Micro via hole lasering capability (2 mil)
- Ni/Au R2R plating processes for wire bonding or flip chip assembly technologies
- Capable of integrating functions such as battery, display, IC chips and switches
- Four color graphic printing capabilities
- UL rated
- RoHS compliant
RFID Tags
- Broad range of dielectric materials: PET, PI, PEN, PEI, thin glass epoxy with flame retardant adhesive system for UL flammability rating
- Printed polymer ink technology or etched copper
- Deliverable format options include: sheet, singulated, roll-to-roll.
- R2R processing and potential for very long layout manufacturing capability
- High volume Flip Chip die attachment process utilizes both isotropic (Polysolder® Adhesive) and Anisotropic (z-axis) adhesive system.
- Four color graphic printing capabilities
- UL rated
- RoHS compliant
