Parlex Prototyping & Analysis Capabilities

Prototyping & Processing Capabilities

 Ink formulation

  • Conductive
  • Carbon resistor
  • Dielectric
  • Encapsulant
  • Z-axis (ACA)
  • Polysolder (ICA)
  • EMI Shielding
  • Hydrogel

Processing (PTF)

  • Screen printing: MPM flat bed
  • Conveyor 2-zone oven
  • UV curing unit: SPE
  • Cutting / thru hole: SH laser

Assembly

(SMT prototype line located in mfg floor)

  • Stenciling: MPM
  • SMT P&P: Quad IV
  • UV Encapsulant: Fusion
  • Dispensing: EFD; Cam/A lot
  • Z-axis bonding: Unitek
  • Thermal oven: Heller
  • Flip-chip: manual placement
  • Tin/lead soldering: manual
  • Lamination: MPM

 

 

Test & Analysis Capability

Material Analysis

  • Spectroscopy :UV-vis, FTIR
  • Chemical: AA, Titration
  • Thermal: TGA, DSC
  • Rheology: Rheometer,  Viscometer
  • Particle sizing, X-section, Scope
  • Dimension stability measurement
  • Surface: SEM/AFM/EDAX (contract)

Accelerated aging test etc.

  • Thermal cycle: Thermotron
  • Humidity / temperature cycle: Thermotron
  • Water immersion test
  • Flame retarding test

Mechanical

  • Peel, pull, shear: Instron
  • Adhesion, hardness
  • Dynamic and static flex test
  • Membrance life cycle tester
  • Force / displacement test

Electrical

  • Resistivity and Impedance
  • Inductance / Capacitance
  • Leakage current
  • Fuse test

(Spectra analyzer, oscilloscope, multimeter, power supply etc.)

 

More information

- Sales or order information
- Technical requests
- Quote requests

- See examples of products manufactured by Parlex for OEM clients
- Parlex Medical Device Outsourcing & Contract Manufacturing
- Put the additional power of Johnson Electric in motion for your next Medical or Life Sciences Project
- Learn more about Parlex Design and Value Added Services
- View a list of Parlex products and technologies
- See a summary of Parlex Quality Certifications and Manufacturing facilities