Palflex® Plus Adhesiveless, Double-Sided Flexible Printed Circuit Technology·
Palflex® Plus Adhesiveless, Double-Sided Flexible Printed Circuit Technology was developed by Parlex as the high-tech FPC solution to automate many different high-volume, low cost manufacturing operations. Palflex Plus Technology can be adapted to produce a wide variety of products including SMARTCARD FCOS, RFID, Displays, antennas, medical sensors and more. The high thermal resistance, excellent heat dissipation and folding ability of Palflex® Plus FPC Technology make it an ideal substrate for severe duty applications such as Automotive ECU's. Parlex can even SMT-mount your components and deliver finished product to your schedule. Contact your local Parlex representative today for additional information.
Advantages
- Easy to Automate- All substrates available in continuous reel-to-reel formats.
- Wide manufacturing flexibility - Double sided for easier miniaturization- compatible with SMT, wave solder and ACA/ACF attachment.
- Customizable to fit most needs - Available in a wide range of surface finishes, film substrates, thicknesses & hole styles.
- Delivers excellent cosmetics - Thin, uniform flex substrates for easy integration- supports blind microvias. PET substrates available in clear, black & white for the perfect look!
- High reliability, durability & dimensional stability- Adhesiveless construction for better heat tolerance- can be bonded to aluminum heatsinks for excellent heat dissipation.
