PALFlex® Double-Sided Flexible Printed Circuits

PALFlex® Adhesiveless Double-Sided FPC was developed by Parlex as the high-tech solution for a wide-range of high stress product applications in the Automotive, Industrial, Computer, Consumer Electronics, Electronic Identification and Telecommunications industries.

The high thermal resistance, excellent heat dissipation and folding ability of PALFlex® FPCs make it an ideal substrate for severe duty applications such as this engine control unit. We can even SMT-mount your components and deliver finished product to your schedule. Contact your local Parlex representative today for additional information.

Advantages

• High thermal resistance - no adhesives are used in the manufacturing process
• Excellent heat dissipation - due to the flexible substrates used. Substrate can be bonded to metal for added heat dissipation.
• Saves space - Proprietary Universal Hole Generation (UHG) - through-hole plating capability enables double-sided use. Flexible substrate can be easily folded for packaging convenience. Multi-layer printing is also an option.
• Reliable high volume & fast processing - circuits produced using automated roll-to-roll processing
• High quality - all PALFlex® circuits are 100% electrically tested
• Lower cost - Exclusive patented PALFlex® FPC process uses additive copper plating, resulting in less environmental waste than other subtractive copper methods.
• Higher precision - additive plating permits greater control of trace dimensions
• Value-added options - Save time and resources and let Parlex assemble your finished circuit- ask your Parlex representative for details.

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Let Parlex design and assemble your next flexible circuitry challenge! Contact your local Parlex Representative for more information!

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