Rigid-Flex and Multilayer Circuit Designs from Parlex

Rigid flex printed circuit for increased relaibility and improved packaging flexibilityMany Fortune 500 companies trust Parlex engineers to produce their most demanding flexible circuit designs. Whether you need to reliably package your circuitry in limited space with Rigid-Flex or solve a crosstalk shielding issue with Multilayer Flex Circuitry, you can rely on Parlex manufacturing expertise to move your project through to commercialization. Contact your local Parlex Representative today for technical guidance on your next flexible circuitry project

Parlex Rigid- Flex & Multilayer Circuits

Rigid Flex Circuit Advantages:

  • High connection reliability- flexible cable connecting rigid layers is an integral piece of multiple boards
  • Reduce parts count- fewer connectors and cables required
  • Ultimate design flexibility- easily package circuitry in confined spaces or in 3 dimensions while maintaining a rigid substrate
  • Flexible design parameters- circuits can accommodate EMI shielding layers, through-hole assembly, controlled impedance and other customer-specified electrical requirements.

Multilayer Flex Circuit Advantages:

  • Save space- high circuit density system can handle multiple conductive layers
  • High performance and reliability in extreme conditions- even in situations where circuit is exposed to excessive vibration, shock, bending and folding
  • Flexible design parameters- circuits can accommodate EMI shielding layers, through-hole assembly, controlled impedance and other customer-specified electrical requirements.

Parlex Technical Capabilities for Rigid-Flex and Muiltilayer Circuits:

  • 3 mil line & 4 mil space/prototype environment
  • 10 layer rigid flex
  • Reverse bare circuitry
  • Soft tool zif tolerance (+/- 0.003)
  • Control Impedance
  • Micro BGA Assembly
  • Available Materials:
    • PET
    • Polyimide/Adhesive/Adhesiveless
    • 1/2 oz. copper - 6 oz. copper
    • Cover-layer - ½ mil - 5 mil
  • Surface Finishes
    • HAL
    • Gold hard/soft
    • Wire bondable gold
    • Immersion tin plate
    • Flexible soldermask
  • Panel Size
    • 12x18"
    • 18x24"
    • Custom panel size available upon engineering review
- Parlex Design and Value Added Services
- Parlex Quality Certifications and Manufacturing facilities
- Technology Roadmap for Rigid-Flex and Multilayer FPC
- Shielding Selection Guide

Featured Product:

flexible printed circuit with smt mounted led and switches

Let Parlex design and assemble your next flexible circuitry challenge! Contact your local Parlex Representative for more information!