Single and Double Layer FPC Capabilities
Click here to view FPC Dimensional Guidelines
Our routine specifications are listed below. Since we are always adding new capabilities at the request of clients, please contact us if you need a unique requirement that is not listed.
For relevant industry design specifications for flexible circuits, please refer to IPC-2223 (Design Standards for Flexible Circuits)
For relevant industry specifications for acceptability of flexible circuits, please refer to IPC-6013 (Qualification and Performance Specification for Flexible Printed Boards)
| Category | Capability | |
| Products | ||
| Single-Sided Flexible Circuits Double-Sided Flexible Circuits - Standard Adhesive System - PALFlex® Adhesiveless System Flexible Circuit Assemblies |
||
| Maximum number of layers | ||
| copper only | 2 | |
| with shielding | 4 | |
| Material Thicknesses (Min and Max) | ||
| base | MIN - 12.5 um (1/2 mil) MAX - 127 um (5 mil) |
|
| coverlayer | MIN - 12.5 um (1/2 mil) MAX - 127 um (5 mil) |
|
| Copper Weights | ||
| Minimum | 1/4 oz (8 um thick) | |
| Maximum | 3 oz (105 um thick) | |
| Material Types | ||
| Polyimide (PI) | ||
| Polyester (PET) | ||
| Polyethylene Napthalate (PEN) | ||
| Panel Sizes (Panel Process) | ||
| Minimum LxW | 305x229 mm (12"X9") | |
| Maximum LxW | 610x508 mm (24"X20") | |
| Panel Size (Roll-to-roll Process) | ||
| Roll Width | 250mm (9.8") | |
| Length after cut-down | 508 mm (20") | |
| Minimum Line Width | ||
| on 1/2 oz copper | .075 mm (3 mil) | |
| on 1 oz copper | .10 mm (4 mil) | |
| on 2 oz copper | .125 mm (5 mil) | |
| Minimum Spacing | ||
| on 1/2 oz copper | .10 mm (4 mil) | |
| on 1 oz copper | .125 mm (5 mil) | |
| on 2 oz copper | .15 mm (6 mil) | |
| Covercoats | ||
| Standard Coverlayers, with Adhesive | ||
| Photoimageable Coverlays (PIC) | ||
| Soldermasks, including LPISM | ||
| Surface Finish Options | ||
| Tin/Lead Plating | ||
| Pure Tin Plating | ||
| Hot Air Solder Leveling (HASL) | ||
| OSP (Organic Solderability Preservative) | ||
| Electrolytic Hard and Soft Nickel/Gold | ||
| Electroless Nickel Immersion Gold | ||
| Wire Bondable Nickel/Gold | ||
| Immersion Tin | ||
| Immersion Silver | ||
| Stiffener Types | ||
| PI/PET | ||
| FR4/CEM3/CEM1/FR1 | ||
| Steel/Aluminum/Copper | ||
| Assembly Capabilities | ||
| hand placement and soldering | Yes | |
| SMT | Yes | |
| Wave Solder | Yes | |
| Other Capabilities | ||
| Circuit Layout Design | Yes | |
| Impedance Design | Yes | |
| Circuit Resistance Testing | Yes | |
| Flexural Cycle Testing | Yes | |
Featured Product:
Let Parlex design and assemble your next flexible circuitry challenge! Contact your local Parlex Representative for more information!
