SMART TAPE® Roll-to-Roll FPC
SMART TAPE® Roll-to-Roll Semi-Additive Copper FPC employs Parlex exclusive custom built equipment to make superior, cost effective circuits for SMART CARDS, RFID, cell phone and a host of other high volume applications. Traces as small as 70µm wide (0.0028”) enable double sided high density circuitry with 50µm printed through holes especially suitable in today's miniaturizing world. SMART TAPE® Semi-Additive FPC is produced with copper thickness ranging from 1 to 30µm on 50 and 75µm PET, PEI or PI film. Other materials and dimensions are available upon request.
Advantages
- Easy high volume processing- Roll-to-roll format for semi or fully automated component assembly
- Saves space- Double sided high density circuitry provides more functionality in the same dimensions
- Achieve greater miniaturization- Thin adhesiveless material allows the use of thicker chips or chip stack-up creating greater functionality in a smaller form factor
- Manufacturing versatility- Custom thickness of metallization (Cu, Ni/Au, Pd) for compatibility with different assembly processes and for product at the right cost with no unneeded materials
- Vast grade & material choices - Ideal for compatibility with card body and almost all assembly processes (PET, PEI, PI & other materials on request)
SMART TAPE® Roll-to-Roll Semi-Additive Copper FPC is the ideal substrate for SMART CARD assembly (left) or RFID tags and small antennas (right). Contact your local Parlex Representative for more information today.
SMART TAPE® Roll-to-Roll Additive Copper FPC employs environmentally friendly high speed printing technology to make superior, cost effective circuits for RFID, cell phone antennas, automotive circuitry and a host of other high volume applications. Traces as small as 300µ wide (0.012”) can be printed and plated directly onto the flexible substrate material. With no pattern etching required, the process waste streams associated with conventional photolithography are eliminated. SMART TAPE® FPC is routinely produced with ED copper thickness between 8-35µ (1/4 to 1 ounce copper) on 75µ thick (0.003”) polyester film- other materials and dimensions are available upon request.
Advantages
- Easy, high volume processing- with unique roll-to-roll formats
- High performance with low cost- Products are made using our exclusive PALCoat® Flexible Photoimaging Mask technology for ultimate sharpness in high volume printing.
- Higher precision- additive plating permits greater control of trace dimensions
- Environmentally friendly- RoHS compatible
- Parlex Industry Experience- First to commercialize fully additive roll to roll technology on flexible substrates- put our experience to work for your next project!
- Parlex Design and Value Added Services -including SMT and FMOS assembly
- Parlex Quality Certifications and Manufacturing facilities
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Let Parlex design and assemble your next flexible circuitry challenge! Contact your local Parlex Representative for more information!
